Model: 400-hole breadboard
Mechanical rigidity: rigid
Number of layers: single side
Substrate: Copper
Insulation material: organic resin
Insulation thickness: conventional board
Insulation resin: epoxy resin (EP)
Product Name: Solderless Breadboard
Product Model: BB-801
Product size: 5.5×8.2×0.85cm
Number of product holes: 400 holes
1: Suitable for circuit prototyping,
2: ABS plastic panel, tin-plated phosphor bronze contact piece
3: Can be used with 20-29AWG wire
4: Voltage/Current: 300V/3-5A
